Room: Poster Area
Date: Thursday, 21 May 2026
Time: 16:15 - 17:15 CEST
Session code 6CV.7
Biopolymers and bioplastics
Chemical Changes in Mycelium Biocomposites Induced by Fungal-substrate Interactions
Short Introductive summary
Mycelium biocomposites represent a sustainable alternative to conventional polymer foams such as expanded polystyrene and polyurethane. These materials are formed through the colonization of lignocellulosic substrates by the white-rot fungi. Understanding the chemical transformations occurring within the substrate during fungal growth is essential for optimizing biocomposite properties. In this study, substrates composed of hemp (Cannabis sativa) shives and silver birch (Betula pendula) sawdust and sanding dust were inoculated with Trametes versicolor mycelium. Both the initial substrates and the resulting biocomposites were analyzed using the gravimetric method, Fourier-transform infrared spectroscopy (FTIR), elemental CHNS analysis, and pH determination. Following fungal colonization, a decrease in pH, relative lignin content, and C/N ratio was observed, accompanied by an increase in relative protein and inorganic matter concentrations. These results highlight the chemical changes induced by T. versicolor during substrate colonization, providing insights into the bioconversion processes underlying mycelium biocomposite formation.
Presenter
Ilze IRBE
Latvian State Institute of Wood Chemistry, LATVIA
Presenter's biography
Mycelium biocomposites; Biopolymers from natural fibres; Microbial degradation of lignocellulose; Microscopy of wood structure and microorganisms; Fungal diversity in wooden constructions; Biodegradation and conservation of cultural heritage;
Biographies and Short introductive summaries are supplied directly by presenters and are published here unedited
Co-authors:
M. Kampuss, Latvian State Institute of Wood Chemistry, Riga, LATVIA
A. Verovkins, Latvian State Institute of Wood Chemistry, Riga, LATVIA
O. Bikovens, Latvian State Institute of Wood Chemistry, Riga, LATVIA
Session reference: 6CV.7.7